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事业领域

经营以热技术、自动化技术、精密加工技术为中心的机械事业,
实现事业领域持续性投资组合的多变、技术内在化,向Global Player跃进。

Cell Process Machine

  • Diffusion Furnace(POCL)
    Diffusion Furnace(POCL)
    为了形成Diffusion Furnace(POCL)结晶质Si太阳电池核心的 pn 掺杂,
    在p-type(+) 硅片表面将p(IN) 掺杂后, 把它的上边形成n层(-)的设备。
    GENERAL
    • Equipment Size(㎜) : 1,850(W) x 6,490(L) x 3,570(H)
    • Number of process chamber : 5 chambers
    THROUGHPUT
    • Cycle time : 72 mins
    • Wafer throughput POCL with boat 1000 wafer BtB : 4,167 wafers / 1 Cycle
    • Uptime : ≥ 95%
    PROCESS PARAMETER
    • Process Temperature : 700 ~ 1000°C
    • Process Pressure : 50mbar
  • PECVD(SiNx) + FactSheet
    PECVD(SiNx)
    在Tube type PECVD(SiNx) 结晶质硅胶硅片表面挡住太阳光的反射
    从而形成极大化效率的反射防止膜(Anti-reflect coating)的设备
    GENERAL
    • Number of process chamber : 4 chambers
    THROUGHPUT
    • Cycle time : ≤32 mins
    • Boat/wafer : ≥ 2,500 wafers
    • Uptime : ≥ 96.9%
    PROCESS PARAMETER
    • Process Temperature : 300 ~ 550°C
    • Process Pressure : 0.5 ~ 3.0 Torr
  • Printer and Dryer
    Printer and Dryer
    形成Wafer的网格式Circuit lines从而在前/后面Printing电极的设备。
    SOLAP CELL CHARACTERISTIC
    • Solar cell size : 125mm, 156mm
    • Tolerance : ±1㎜
    • Wafer Thickness : 140㎛
    DRYER
    • Dry set temperature max : ≤ 400°C
    • Belt Speed : ≥250ipm (=6,350㎜/min)
  • Firing Furnace
    Firing Furnace
    Screen Printer印刷后, 把硅片上电极paste加热/冷却的机械
    MACHINE THROUGHPUT
    • Maximum : 4,000 wafers/hr
    • Number of Lane : 2 Lanes
    DRYING SECTION
    • Heating Zone : 4 zones
    • Temperature (Wafer) : Operating max. 350°C
    FIRING ZONE
    • Heating Zone : 6 zones
    • Temperature (Wafer) : Operating max. 850°C
    COOLING SECTION
    • Cooling Zone : 3 zones
    • Outlet Temperature (Wafer) : 40°C
  • Test & Sorter
    Test & Sorter
    检查Cell的品质及测量电性从而分类最终等级的设备
    SOLAR CELL
    • Solar Cell Size : 156㎜ x 156㎜ ± 1㎜
    • Wafer Thickness : 180 ± 20㎛, 200 ± 20㎛
    • Shape : Square multi & Mono Pseudo square
    CARRIER TYPE
    • Stack magazine : For max. 200 wafers
    • Sorting Bin : For max. 150 wafers
    SPECIFICATION
    • Dimension : 3,100(W) x 13,660(L) x 2,750(H)
    • Gross Product Capacity : ≥ 3,600 Wafer/hours
    • Mechnical yield : ≥ 99%
    • Noise Emission : Approx. ≤70 dB
  • Cell Process Automation System
    Cell Process Automation System
    • WINS Loading / Unloading System
    • Wet Bench 1 Loading / Unloading System
    • POCL Loading / Unloading System
    • Wet Bench 2 Loading / Unloading System
    • RPCV Loading / Unloading System
    • PECVD Loading / Unloading system
    • Printer Loading / Unloading system
    • Automated Material Handling System
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